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United States Utility Patents
5,790,380 - 5,790,389
Previous 10 Next 10
| Number | | Title |
|
5,790,380 |
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Method for fabricating a multiple chip module using orthogonal reorientation of connection planes |
|
5,790,381 |
|
Integrated circuit package assembly |
|
5,790,382 |
|
Stiffened printed circuit board |
|
5,790,383 |
|
Printed circuit board |
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5,790,384 |
|
Bare die multiple dies for direct attach |
|
5,790,385 |
|
One-chip electronic composite component |
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5,790,386 |
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High I/O density MLC flat pack electronic component |
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5,790,387 |
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Process for fixing a winding to an electronic circuit and a packaged electronic component produced therefrom |
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5,790,388 |
|
Antiseismic static electrical converter apparatus |
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5,790,389 |
|
Consolidated soft-switching AC/DC converters |
For U.S. patent law, rules, and procedures see MPEP.
Disclaimer. Information presented on this page while believed to be reliable, is provided "as is" with no warranties of its accuracy or timeliness. For legal advice seek help of a licensed professional.
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